reliability report for MAX5961etm+ plastic encapsulated devices december 18, 2008 maxim integrated products 120 san gabriel dr. sunnyvale, ca 94086 MAX5961etm+ approved by ken wendel quality assurance director, reliability engineering maxim integrated products. all rights reserved. page 1/5
conclusion MAX5961etm+ the MAX5961etm+ successfully meets the quality and reliability standards required of all maxim products. in additio n, maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet maxim"s quality and reliabili ty standards. table of contents i. ........device description v. ........quality assurance information ii. ........manufacturing information vi. .......reliability evaluation iii. .......packaging information iv. .......die information .....attachments i. device description a. general the MAX5961 0 to 16v, quad, hot-swap controller provides complete protection for systems with up to four distinct supply voltag es. the device allows the safe insertion and removal of circuit cards into live backplanes. the MAX5961 is an advanced hot-swap controller that monit ors voltage and current with an internal 10-bit adc. the device provides two levels of overcurrent circuit-breaker protection; a fast-trip thre shold for a fast turn-off, and a lower slow-trip threshold for a delayed turn-off. the maximum overcurrent circuit-breaker threshold range is set independentl y for each channel with a trilevel input (ilim_) or by programming though an i2c interface. the internal 10-bit adc is multiplexed to monitor the outp ut voltage and current of each hot-swap channel. the total time to cycle through all the eight measurements is 100s (typ). each 10-bit value is stored i n an internal circular buffer so that 50 past samples of each signal can be read back through the i2c interface at any time or after a fault condition . the MAX5961 can be configured as four independent hot-swap controllers, hot-swap controllers operating in pairs, or as a group of four hot-swap co ntrollers. the device also includes five digital comparators per hot-swap channel to implement overcurrent warning, two levels of overvoltage detecti on, and two levels of undervoltage detection. the limits for overcurrent, overvoltage, and undervoltage are user-programmable. when any of the measur ed values violates the programmable limits, an external active-low alert signal is asserted. in addition to the active-low alert signal, depending on the selected operating mode, the MAX5961 can deassert a power-good signal and/or turn-off the external mosfet. the MAX5961 is available in a 48-pin thin qfn package and operates over the -40c to +85c extended temperature range. maxim integrated products. all rights reserved. page 2/5
ii. manufacturing information MAX5961etm+ a. description/function: 0 to 16v, quad, hot-swap controller with 10-bit current and voltage monitor b. process: b8 c. number of device transistors: 156582 d. fabrication location: california, texas, or oregon e. assembly location: china, philippines, and thailand f. date of initial production: 2008 iii. packaging information a. package type: 48-pin tqfn 7x7 b. lead frame: copper c. lead finish: 100% matte tin d. die attach: ablestick 8200 e. bondwire: au (.001 mil dia.) f. mold material: epoxy with silica filler g. assembly diagram: #05-9000-2905 h. flammability rating: class ul94-v0 i. classification of moisture sensitivity per jedec standard j-std-020-c level 1 j. single layer theta ja: 36c/w k. single layer theta jc: 0.8c/w l. multi layer theta ja: 25c/w m. multi layer theta jc: 0.8c/w iv. die information a. dimensions: 216 x 191 mils b. passivation: si 3 n 4 /sio 2 (silicon nitride/ silicon dioxide c. interconnect: aluminum/si (si = 1%) d. backside metallization: none e. minimum metal width: 0.8 microns (as drawn) f. minimum metal spacing: 0.8 microns (as drawn) g. bondpad dimensions: 5 mil. sq. h. isolation dielectric: sio 2 i. die separation method: wafer saw maxim integrated products. all rights reserved. page 3/5
v. quality assurance information a. quality assurance contacts: ken wendel (director, reliability engineering) bryan preeshl (managing director of qa) b. outgoing inspection level: 0.1% for all electrical parameters guaranteed by the datasheet. 0.1% for all visual defects. c. observed outgoing defect rate: < 50 ppm d. sampling plan: mil-std-105d vi. reliability evaluation a. accelerated life test MAX5961etm+ the results of the 135c biased (static) life test are pending. using these results, the failure rate ( ) is calculated as follows: = 1 = 1.83 (chi square value for mttf upper limit) mttf 192 x 4340 x 48 x 2 (where 4340 = temperature acceleration factor assuming an activation energy of 0.8ev) = 22.91 x 10 -9 = 22.91 f.i.t. (60% confidence level @ 25c) the following failure rate represents data collected from maxim?s reliability monitor program. maxim performs quarterly 1000 hour life test monitors on its processes. this data is published in the product reliability report found at http://www.maxim-i c.com/. current monitor data for the b8 process results in a fit rate of 2.71 @ 25c and 17.30 @ 55c (0.8 ev, 60% ucl) b. moisture resistance tests the industry standard 85c/85%rh or hast testing is monitored per device process once a quarter. c. e.s.d. and latch-up testing the nq09 die type has been found to have all pins able to withstand a hbm transient pulse of +/-2500v per jedec jesd22-a114-d. latch-up testing has shown that this device withstands a current pulse of +/-100ma and an over voltage of 1.5xvcc max. maxim integrated products. all rights reserved. page 4/5
table 1 reliability evaluation test results MAX5961etm+ MAX5961etm+ test item test condition failure identification sample size number of failures static life test (note 1) ta = 135c biased time = 192 hrs. dc parameters & functionality 48 0 moisture testing (note 2) 85/85 ta = 85c rh = 85% biased time = 1000hrs. dc parameters & functionality 77 0 mechanical stress (note 2) temperature cycle -65c/150c 1000 cycles method 1010 dc parameters & functionality 77 0 note 1: life test data may represent plastic dip qualification lots. note 2: generic package/process data maxim integrated products. all rights reserved. page 5/5
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